Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Summary
The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
Key Responsibilities
Package Health Metrics & Monitoring
Define quantitative package health metrics
Develop detection mechanisms and monitoring dashboards for continuous health assessment.
Perform electrical and mechanical characterization of packages.
Inline Defect Characterization
Implement real-time defect detection and classification (critical vs. non-critical).
Conduct next-level characterization for critical defects and integrate findings into predictive models.
Advanced Analytics & Knowledge Base
Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes.
Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes.
End-to-End Traceability
Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages.
Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures.
Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus
Strong understanding of semiconductor packaging process, material interaction and properties.
Ability to work cross-functionally with process, equipment, and reliability teams.
Additional/Preferred Qualifications
Experience with AI/ML tools or statistical modeling.
Knowledge of defect inspection systems and inline metrology.
Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
Strong problem-solving and documentation skills
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
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